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铱拉斯迷你大师系列技术参数

品牌	铱拉斯/ELAS	型号	Mini MASTER

铱拉斯迷你大师系列详细介绍

Mini MASTER Overview

Mini MASTER workstations are tailored for specific applications. Intended primarily for Research and Development laboratories, Mini MASTERs offer excellent payback while keeping high performance.

Specification
Description
Specifications
Options
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Mini MASTER's are high payback laser micro machining workstations tailored for specific applications in Research and Development laboratories or small batch production.
Being smaller brothers of MASTER workstations, Mini MASTERs perform marking, cutting drilling, surface structuring and fit into reduced foot print.
Ultra short pulse lasers and SCA laser micro machining software complies to high requirements in solar cells applications, extra hard materials processing (like tungsten carbide), etc.

Description

Speed and spatial precision	Precision of laser micro machining is achieved by ultra-short laser pulses, state of the art Galvo Scanners and optics. In Mini MASTER workstations nano or pico second laser pulses cause minimal heat-affected zone and maximize spatial precision. High pulse repetition rate and adequate pulse energy ensure fast material removal during ablation or marking. Options of three different working wavelengths offer many machining possibilities for wide range of materials.
Accuracy of positioning	Maximum firing accuracy and spatial resolution are achieved due to advanced beam delivery scheme. Fast galvoscanner for high throughput.
Safety and robustness	Class 1 laser-safe and clean-room compatible enclosure ensures robustness and reliability.
Advanced control	Designed specifically for laser micro machining, SCA software provides automatic control of Mini MASTER workstation, easy design or import of patterns, flexible modification and simulation of micro machining process
Applications	Ablation	Manufacturing of high aspect Micromolds from conductive and non-conductive materials using multiple 2D process Production of high-aspect ratio micro- channels fo Microfluidics Structuring high density circuit boards for thin films electronics
	Cutting and drilling	Flexible production of Micromechanics components Cutting and drilling of saphire and other crystal materials High-aspect-ratio holes for injectors Filter production
	Marking	Surface & intravolume marking of transparent materials Flexible production of Identification & anti counterfeiting marks
	Surface Structuring	Clean and accurate modification of wettability characteristics of a wide range of engineering materials Selective surface structuring for Antireflection Lubrication modification of 2D and 3D objects

Specifications

Galvo scanner

Scanning field	100 x 100 mm
Focal lenght of f-Theta lens	160 mm
Marking speed	3,5 m/s
Positioning speed	15,0 m/s
Laser and motion synchronization	Laser pulse synchronized output

Optics

Spot size (optics and wavelength dependent)	down to 3 μm
Output beam	single- or multi-wavelength
System control	Industrial type control computer LCD display and keyboard SCA software running on MS Windows OS
Laser and motion synchronization	Laser pulse synchronized output

Physical Characteristics

Dimensions (approx.), W×D×H	1110×760×1440 mm
Power requirements, maximum	2000 W

(* Dimensions can be adjusted during design of ordered workstation)

Options

Laser options

Laser	Wawelenght and Power	Pulse energy	Pulse duration	Repetition rate	Beam quality
Nanosecond laser	20 W @ 1064 nm 8 W @ 532 nm	0.2 mJ @ 1064 nm	< 30 ns	5 - 100 kHz	M2 < 1.3
Picosecond laser	> 16 W @ 1064 nm > 8 W @ 532 nm > 4 W @ 355 nm	> 160 μJ @ 1064 nm	< 10 ps	Single shot to 500 kHz	M2 < 1.5

Customization options

Tables for samples with motorized or manual Z and tilt axis adjustment
Automatic harmonics switching
Automatic focus adjustment
Automatic scanner self - calibration
Vacuum chucks for sample holding
Dust and fume extraction system

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